1022_RELIABILITY AND ANALYSIS OF ELECTRONIC PACKAGES
Course Period：FromNow ~ Any Time
Course Intro
Course Plan
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1. 電子封裝可靠度與分析課程簡介_Jeffrey (Security C)
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4 封裝層級可靠度實驗量測與失效分析一_Curtis
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4 封裝層級可靠度實驗量測與失效分析二_Curtis
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5. 微機電系統之封裝與失效分析_Oudi (Security C)
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6. 封裝可靠度有限元素分析簡介_JimDL(Security C)
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7. 應力可靠度實驗量測與失效分析_Sean (Security C)
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8. 化學分析與實驗量測一_Iris (Security C)
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9. 材料分析與實驗量測 二_Min (Security C)
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10. 銲錫界面反應與電遷移現象_Chandler_(Security C)
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13.電遷移失效分析與工程實例_(Security B)
Co-Instructor(s)
賴逸少
賴逸少
Co-Instructor(s)
謝宇涵
謝宇涵
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