1031_AN INTRODUCTION OF IC PACKAGING
Course Period：FromNow ~ Any Time
Course Intro
Course Plan
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1. 課程與封裝結構介紹_楊秉豐(Security C)
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2. 半導體產業材料之運用_吳昇翰(Security C)
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3. 綠色環保封裝_郭俊良(Security C)
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4
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5. 封裝前段製程簡介_饒邦睿(Security C)
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6. 封裝後段製程簡介_林律甫(Security C)
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7. 模組封裝_林政男(Security B)
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9. 覆晶封裝技術_鄭博仁(Security C)
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10. 3D IC 封裝技術_余瑞益(Security C)
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12. 電性分析_王陳肇(Security C)
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13
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14. 應力分析_陳道隆(Security C)
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15. 材料分析_蕭友享(Security C)
Co-Instructor(s)
賴逸少
賴逸少
Co-Instructor(s)
洪振修
洪振修
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