1081_電子封裝簡介
上課期間：從 即日起 到 無限期
課程介紹
課程安排
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Ch1_introduction
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Ch2_THE ROLE OF PACKAGING IN MICROELECTRONICS
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Ch3_THE ROLE OF PACKAGING IN microsystem [Autosaved]
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Ch4_FUNDAMENTALS OF ELECTRICAL PACKAGE DESIGN_1
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Ch5_FUNDAMENTALS OF ELECTRICAL PACKAGE DESIGN_2
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Chi-t
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Electronic packaging_參考資料
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JMEMSEtchRates2(2003)
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Normal DIstribution_1
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Normal DIstribution_2
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Runt's rule
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Sol_1
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Sol_2
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ch10_IC_assembly packaging
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ch11_wafer level packaging
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ch12_Passive components
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ch13_MEMS packaging
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ch14_FUNDAMENTALS OF Packaging manufacturing
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ch15_FUNDAMENTALS OF Optical electronics
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ch6_Reliability
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ch7_Thermal management
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ch8_single level packaging
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ch9_multi-chip packaging
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chapter_solder_opkg
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chi-square-table-1-638
教師 / 胡龍豪
相關課程
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