1011_AN INTRODUCTION OF IC PACKAGING
Course Period：FromNow ~ Any Time
Course Intro
Course Plan
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Ch01 課程與封裝結構介紹
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Ch02 半導體產業綜觀_趙興華pdf
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Ch03 綠色環保封裝
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Ch04 基板設計概論
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Ch05 封裝前段製程簡介
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Ch06 封裝後段製程簡介
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Ch07 Cap Design Conslderations
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Ch07 Gold Wire
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Ch07 Wire+Bond+Process
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Ch08-Bumping and WLCSP Technology
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Ch09 覆晶封裝技術-鄭博仁
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Ch10 3D IC packaging Introduction_ 王盟仁
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Ch11 模組封裝
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Ch12 微機電封裝概論_歐英德
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Ch13 Optoelectronic Packaging (v1.0)_Freeman
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Ch14 電性分析
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Ch15 散熱機制
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Ch16 應力分析
Co-Instructor(s)
賴逸少
賴逸少
Co-Instructor(s)
詹益添
詹益添
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